Printed Circuit Boards: Design, Fabrication, Assembly and TestingThis domain derives from such diverse disciplines as electronics, mechanical engineering, fluid dynamics, thermodynamics, chemistry, physics, metallurgy and optics. The author, with nearly four decades of experience in R&D, technology development, and education and training, provides a practical and hand-on approach to the subject, by covering the latest technological developments and covering all the vital aspects of PCB, i.e. design, fabrication, assembly, testing, including reliability and quality.With this coverage, the book will be useful to designers, manufacturers, and students of electrical and electronic engineering. |
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Page 267
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Page 684
... laminate stiffness 437 laminate, epoxy 347 laminate, high speed/high
frequency 281 laminate, melamine 273 laminate, phenolic 267, 347 laminate,
polyamide 273 laminate, polyester 273 laminate, PTFE 272 laminate, silicon 273
laminate, ...
... laminate stiffness 437 laminate, epoxy 347 laminate, high speed/high
frequency 281 laminate, melamine 273 laminate, phenolic 267, 347 laminate,
polyamide 273 laminate, polyester 273 laminate, PTFE 272 laminate, silicon 273
laminate, ...
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Contents
CHAP01 | 1 |
CHAP02 | 25 |
CHAP02A | 35 |
CHAP02B | 45 |
CHAP02C | 55 |
CHAP02D | 65 |
CHAP02E | 75 |
CHAP02F | 86 |
CHAP07A | 303 |
CHAP08 | 310 |
CHAP08A | 346 |
CHAP09 | 365 |
CHAP10 | 384 |
CHAP11 | 414 |
CHAP12 | 427 |
CHAP13 | 453 |
Other editions - View all
Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid adhesive applications artwork assembly ball grid array base material capacitance capacitors cent chemical chip cleaning coating conductive conductor width connection connector copper copper foil defects density devices diameter dielectric diodes dissipation factor double-sided drill dry film edge electrical electroless electronic electroplating epoxy equipment etchant etching fabrication flexible flexible circuits flux frequency grid heat hole impedance inductors inspection insulation integrated circuits interconnections laminate laser layers layout machine manufacturing mechanical metal method microvia multi-layer boards operation oxidation package pads pattern photoplotter pins placement plated through-hole polyimide printed board printed circuit board production reflow reliability removed resin resistance resistors rinse screen printing shown in Figure side signal solder joint solder mask soldering iron solution standard substrate surface mount technique temperature thermal thickness through-hole tool transistors typical usually voltage wave impedance wave soldering wire