Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 439
... adhesive as possible by selectively reducing the use of adhesive-based material, particularly cover coats and cast adhesives made with modified acrylics, from critical areas such as the PTH portion of the rigid flex circuit. The thermal ...
... adhesive as possible by selectively reducing the use of adhesive-based material, particularly cover coats and cast adhesives made with modified acrylics, from critical areas such as the PTH portion of the rigid flex circuit. The thermal ...
Page 502
... adhesives for SMT assembly. Adhesives must be stored in a cool, dry and dark location. a Method of application of flux; The flux is always. 502 Printed Circuit Boards 13.11.1 Requirements of Adhesive 13.11.2 Application of Adhesive.
... adhesives for SMT assembly. Adhesives must be stored in a cool, dry and dark location. a Method of application of flux; The flux is always. 502 Printed Circuit Boards 13.11.1 Requirements of Adhesive 13.11.2 Application of Adhesive.
Page 503
... adhesive with a low viscosity, “runs” at about 20 cm per second and a high viscosity adhesive is printed at about 1.3 cm per second. a Pressure: Adhesives with higher viscosity need higher pressure than one with lower viscosity. A rule ...
... adhesive with a low viscosity, “runs” at about 20 cm per second and a high viscosity adhesive is printed at about 1.3 cm per second. a Pressure: Adhesives with higher viscosity need higher pressure than one with lower viscosity. A rule ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire