Printed Circuit Boards: Design, Fabrication, and Assembly
McGraw Hill Professional, 2005 M09 7 - 704 pages
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
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2.94 Land Grid Array (LGA) 1.78 mm pads at 2.54 mm centres 0.762 mm pads at
1.27 mm centres BGA (Ball Grid Arrays) These refer to actually any type of IC
package that routes from the die and connects to the PCB via solder bumps.
Ball pitches are decreasing from 1.27 mm to 1.0 mm and as low as 0.5 mm for
new chip scale Balls packaging. For high reliability applications, several vendors
offer a ball grid array package with a ceramic substrate. Multi-chip packages are
Ball grid array (BGA), fine pitch ball grid array (FBGA), and other chip-scale
packages (ACSP) require special consideration for successful assembly. As
package geometry continues to shrink, processing margins decrease when
compared to ...
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1 Basics of Printed Circuit Boards
2 Electronic Components
3 Layout Planning and Design
15 other sections not shown