Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 40
Design, Fabrication, and Assembly R. S. Khandpur. 2.6.1 Types of Capacitors Capacitors are categorized into various types (Figure 2.20) depending upon the dielectric medium used in their construction. The size of the capacitor, its ...
Design, Fabrication, and Assembly R. S. Khandpur. 2.6.1 Types of Capacitors Capacitors are categorized into various types (Figure 2.20) depending upon the dielectric medium used in their construction. The size of the capacitor, its ...
Page 41
Design, Fabrication, and Assembly R. S. Khandpur. Mica Capacitors A mica capacitor is made by directly metallizing ... Capacitors Ceramic capacitors generally employ barium titanate as the dielectric medium. However, low-loss ceramic ...
Design, Fabrication, and Assembly R. S. Khandpur. Mica Capacitors A mica capacitor is made by directly metallizing ... Capacitors Ceramic capacitors generally employ barium titanate as the dielectric medium. However, low-loss ceramic ...
Page 43
... capacitor passes signals. Depending on the circuit configuration, the capacitor can pass the signal to the next stage or it can shunt it to ground. The impedance of the capacitor varies with frequency as follows: = 1 2pfC All capacitors ...
... capacitor passes signals. Depending on the circuit configuration, the capacitor can pass the signal to the next stage or it can shunt it to ground. The impedance of the capacitor varies with frequency as follows: = 1 2pfC All capacitors ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
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acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire