Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 86
... chip is quite high. The contents of these ROMs cannot be altered after manufacture. Once the chip is made, the actual chip can cost very little money. They use very little power, are extremely reliable and, in the case of most small ...
... chip is quite high. The contents of these ROMs cannot be altered after manufacture. Once the chip is made, the actual chip can cost very little money. They use very little power, are extremely reliable and, in the case of most small ...
Page 87
... chip or pre-determined sections of it called blocks. Flash memory works much faster than traditional EEPROM because ... chip is enabled or disabled through the chip select (CS) input. ROMs do not provide Chip select DataoutputstoDD ...
... chip or pre-determined sections of it called blocks. Flash memory works much faster than traditional EEPROM because ... chip is enabled or disabled through the chip select (CS) input. ROMs do not provide Chip select DataoutputstoDD ...
Page 96
... chip packages are usually BGAs or QFPs containing two to four die. Fig. 2.95 Plastic base grid array package ... Chip Scale Package ; Fine-pitch BGA. Package is max. 120%>chip size. mBGA - Chip Scale Package; trademark of Tessera Flip ...
... chip packages are usually BGAs or QFPs containing two to four die. Fig. 2.95 Plastic base grid array package ... Chip Scale Package ; Fine-pitch BGA. Package is max. 120%>chip size. mBGA - Chip Scale Package; trademark of Tessera Flip ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire