Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 528
... defect. If the splashes are not entrapped or encapsulated and the adhesion is low, the splashes may detach and cause erratic shorts. 13.14.3 Solder Joint Defects and their Common Causes A wide range of defects is observed in the ...
... defect. If the splashes are not entrapped or encapsulated and the adhesion is low, the splashes may detach and cause erratic shorts. 13.14.3 Solder Joint Defects and their Common Causes A wide range of defects is observed in the ...
Page 562
... defects are picked up, rectified and brought within acceptable limits. 14.1.1 Classification of Defects Any aspect or parameter of the printed board that does not conform to specified requirements is known as a defect. Defects are ...
... defects are picked up, rectified and brought within acceptable limits. 14.1.1 Classification of Defects Any aspect or parameter of the printed board that does not conform to specified requirements is known as a defect. Defects are ...
Page 596
... Defects: Visual inspection may be carried out to look for the following surface defects shown in Figure 14.15: area a Void (absence of material in a localized area); a Dent (depression in the conductive foil, which nor- mally does not ...
... Defects: Visual inspection may be carried out to look for the following surface defects shown in Figure 14.15: area a Void (absence of material in a localized area); a Dent (depression in the conductive foil, which nor- mally does not ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire