Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 139
... -sided, double-sided, or multilayered. Multi-layer boards are preferred when the component densities possible with. Layout Planning and Design 139 3.9 Cooling Requirements and Packaging Density 3.9.1 Heat Sinks 3.9.2 Packaging Density.
... -sided, double-sided, or multilayered. Multi-layer boards are preferred when the component densities possible with. Layout Planning and Design 139 3.9 Cooling Requirements and Packaging Density 3.9.1 Heat Sinks 3.9.2 Packaging Density.
Page 185
... density assemblies. The IPC has selected High-Density Interconnection Structures (HDIS) as a term to refer to all the various microvia technologies (Holden, 2003a). By using microvias, components can be placed much closer to each other ...
... density assemblies. The IPC has selected High-Density Interconnection Structures (HDIS) as a term to refer to all the various microvia technologies (Holden, 2003a). By using microvias, components can be placed much closer to each other ...
Page 339
... Density; a pH value; a Surface tension; and a Hull cell test. Density: The density of an electrolyte depends upon the salt content in the solution. It can be measured by using an instrument called hydrometer. The density measurement ...
... Density; a pH value; a Surface tension; and a Hull cell test. Density: The density of an electrolyte depends upon the salt content in the solution. It can be measured by using an instrument called hydrometer. The density measurement ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire