Printed Circuit Boards: Design, Fabrication, and Assembly
McGraw Hill Professional, 2005 M09 7 - 704 pages
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
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AnyR in series with C will reduce the capacitor's ability to pass current in
response to a variant applied voltage and it will dissipate heat, which is wasteful
and could lead to failure of the component. The dissipation factor (DF) is
The effects of temperature and frequency variations on the dielectric constant
vary for different materials. 6.3.4 Dissipation Factor The dissipation factor of an
insulating material is the ratio of the total power loss (in watts) in the material to
The dissipation factor is expressed as tan d (the tangent value of loss angle d ).
The dissipation is directly related to the resistive power loss in a laminate.
Therefore, for an electronic circuit operating at a high power loss, it is desirable to
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1 Basics of Printed Circuit Boards
2 Electronic Components
3 Layout Planning and Design
15 other sections not shown