Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 299
... dry film photo-resists. The dry film resist is available as a composite material consisting of three different layers as shown in Figure 7.11. The photo polymer layer of 17 to 75 mm thickness is sandwiched between a layer of polyester ...
... dry film photo-resists. The dry film resist is available as a composite material consisting of three different layers as shown in Figure 7.11. The photo polymer layer of 17 to 75 mm thickness is sandwiched between a layer of polyester ...
Page 301
... dry film photo-resist manufacturers. After lamination, the board is separated from the continuously coming dry film by a knife cut. The distance between top chamber and the surface heating which is called the free space must be at the ...
... dry film photo-resist manufacturers. After lamination, the board is separated from the continuously coming dry film by a knife cut. The distance between top chamber and the surface heating which is called the free space must be at the ...
Page 359
... dry film. In these cases, it is necessary to use a thinner solder mask coating, which can be obtained by using a 50 mm thick dry, film instead of a 100 mm film. 8.10.8 Reliability of Solder Mask The reliability of the solder mask is ...
... dry film. In these cases, it is necessary to use a thinner solder mask coating, which can be obtained by using a 50 mm thick dry, film instead of a 100 mm film. 8.10.8 Reliability of Solder Mask The reliability of the solder mask is ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
Other editions - View all
Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire