Printed Circuit Boards: Design, Fabrication, and Assembly
McGraw Hill Professional, 2005 M09 7 - 704 pages
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
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Increased thickness, uniformity and ease of application are the strong points for
the dry film photo-resists. The dry film resist is available as a composite material
consisting of three different layers as shown in Figure 7.11. The photo polymer ...
film, the encapsulation achieved will be uniform throughout the board, provided
the conductor height is not more than the thickness of the dry film. A minimum
encapsulation of 25 mm can be obtained throughout the PCB surface by using
The use of thick dry film solder mask provides this requirement as also a flat
surface for the application of the glue as shown in Figure 8.23. Certain types of
flat components are found to exhibit single-side lifting or 'tomb-stoning' during
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1 Basics of Printed Circuit Boards
2 Electronic Components
3 Layout Planning and Design
15 other sections not shown
Other editions - View all
Printed Circuit Boards: Design, Fabrication, Assembly and Testing
R. S. Khandpur
Limited preview - 2005
Printed Circuit Boards : Design, Fabrication, and Assembly: Design ...
No preview available - 2005