Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 313
Design, Fabrication, and Assembly R. S. Khandpur. 8.2. Electroplating. Electroplating is the process by which a metal is deposited on a conductive surface by passing a direct current through an electrolytic solution containing a soluble ...
Design, Fabrication, and Assembly R. S. Khandpur. 8.2. Electroplating. Electroplating is the process by which a metal is deposited on a conductive surface by passing a direct current through an electrolytic solution containing a soluble ...
Page 317
... electroplating, buffers have an important influence on the process parameters. 8.2.6 Anodes In electroplating, the positive electrodes or anodes are used in the form of bars, plates, rods or pallets. The metal used may be the same as ...
... electroplating, buffers have an important influence on the process parameters. 8.2.6 Anodes In electroplating, the positive electrodes or anodes are used in the form of bars, plates, rods or pallets. The metal used may be the same as ...
Page 337
... electroplating on the tabs; (4-5 micro thickness) f) Rinsing; Demineralised water g) Gold strike; Solution treatment h) Gold electroplating; i) Rinsing; and j) Drying. The fingers or tabs are electroplated (Figure 8.11) by manual or ...
... electroplating on the tabs; (4-5 micro thickness) f) Rinsing; Demineralised water g) Gold strike; Solution treatment h) Gold electroplating; i) Rinsing; and j) Drying. The fingers or tabs are electroplated (Figure 8.11) by manual or ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
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acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire