Printed Circuit Boards: Design, Fabrication, and Assembly
McGraw Hill Professional, 2005 M09 7 - 704 pages
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
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The commonly used resins in the manufacture of base materials are phenol,
polyester, cyanate ester, epoxy and polyimide. Of these, the epoxies and
phenolics are used for about 90 per cent of all laminates. They are mostly
synthetic types of ...
6.4.2 Epoxy Laminates The base material is reinforced with glass fibre or paper
fibre as filler and epoxy resin and the copper foil is pressed over it to get copper
clad laminates. Hence they are called 'glass epoxy copper clad laminates' or ...
Epoxies provide good insulation resistance, high bond strength and low curing
temperature. A disadvantage of epoxies is that defective components are difficult
to remove during repair. They are typically single-component heat-curing
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1 Basics of Printed Circuit Boards
2 Electronic Components
3 Layout Planning and Design
15 other sections not shown