Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 269
... epoxy resin and the copper foil is pressed over it to get copper clad laminates. Hence they are called 'glass epoxy copper clad laminates' or 'paper epoxy copper clad laminates' depending upon the type of filler used. During lamination, the ...
... epoxy resin and the copper foil is pressed over it to get copper clad laminates. Hence they are called 'glass epoxy copper clad laminates' or 'paper epoxy copper clad laminates' depending upon the type of filler used. During lamination, the ...
Page 272
... epoxy laminates are: a NEMA-FR3-flame resistant paper epoxy; a General purpose glass epoxy G-10, temperature-resistant glass epoxy G-11; a Fire retardant glass epoxy FR-4; and a Fire-and temperature-resistant glass epoxy Fr-5. Flame ...
... epoxy laminates are: a NEMA-FR3-flame resistant paper epoxy; a General purpose glass epoxy G-10, temperature-resistant glass epoxy G-11; a Fire retardant glass epoxy FR-4; and a Fire-and temperature-resistant glass epoxy Fr-5. Flame ...
Page 387
... epoxy laminate will have a closer fit between the die and the punch as the glass epoxy laminate is found to exhibit less resilience as compared to paper-based laminates. Glass blanking is always done at room temperature. Since the glass ...
... epoxy laminate will have a closer fit between the die and the punch as the glass epoxy laminate is found to exhibit less resilience as compared to paper-based laminates. Glass blanking is always done at room temperature. Since the glass ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire