Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 458
... flux during the soldering process. Fluxes should remove the tarnish from base metals and prevent them from reforming oxides while soldering. The effectiveness of the flux in removing oxide is called “activity” which depends on the ...
... flux during the soldering process. Fluxes should remove the tarnish from base metals and prevent them from reforming oxides while soldering. The effectiveness of the flux in removing oxide is called “activity” which depends on the ...
Page 460
... flux. The plasticized flux is placed in 1, 3 or 5 channels within the solder itself. The flux to solder ratio is mentioned either by volume or by weight. Cored wires with rosin flux contain mostly 2 per cent to 3.5 per cent flux by ...
... flux. The plasticized flux is placed in 1, 3 or 5 channels within the solder itself. The flux to solder ratio is mentioned either by volume or by weight. Cored wires with rosin flux contain mostly 2 per cent to 3.5 per cent flux by ...
Page 462
... flux' is used. Flux is needed to remove the microscopic film of oxides on the surfaces of metals to be soldered and it forms a protective film that prevents re-oxidation while the connection is heated to the point at which the solder ...
... flux' is used. Flux is needed to remove the microscopic film of oxides on the surfaces of metals to be soldered and it forms a protective film that prevents re-oxidation while the connection is heated to the point at which the solder ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire