Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 258
... foil must satisfy strict quality requirements. Its resistivity should not exceed 0.1594 ohmgram/m2 at 20 °C. The foil should be free from pin holes, pits, scratches and nodules. Copper foil is available in two forms: rolled annealed copper ...
... foil must satisfy strict quality requirements. Its resistivity should not exceed 0.1594 ohmgram/m2 at 20 °C. The foil should be free from pin holes, pits, scratches and nodules. Copper foil is available in two forms: rolled annealed copper ...
Page 434
... foil), and (ii) electrodeposited foil. The manner in which foils are manufactured, either rolled annealed or electrodeposited, determines their mechanical characteristics. Each type of foil is further categorized into grades, on the ...
... foil), and (ii) electrodeposited foil. The manner in which foils are manufactured, either rolled annealed or electrodeposited, determines their mechanical characteristics. Each type of foil is further categorized into grades, on the ...
Page 436
Design, Fabrication, and Assembly R. S. Khandpur. Raw foil Treated foil Stage I: Bonding (anchoring) treatment Stage II: Stage III: Thermal barrier (yellow) Stabilization (anti-oxidation) Foil Stabilization Treatment: Also called ...
Design, Fabrication, and Assembly R. S. Khandpur. Raw foil Treated foil Stage I: Bonding (anchoring) treatment Stage II: Stage III: Thermal barrier (yellow) Stabilization (anti-oxidation) Foil Stabilization Treatment: Also called ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire