Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 96
... substrate, and is Encapsulation Substrate enclosed in a plastic mould (Figure 2.95). Ball pitches are decreasing from 1.27 mm to 1.0 mm and as low as 0.5 mm for new chip scale Balls packaging. For high reliability applications, several ...
... substrate, and is Encapsulation Substrate enclosed in a plastic mould (Figure 2.95). Ball pitches are decreasing from 1.27 mm to 1.0 mm and as low as 0.5 mm for new chip scale Balls packaging. For high reliability applications, several ...
Page 321
... substrate is rinsed to ensure that none of the chemicals is transferred to the next bath. Each step relies upon the ... substrate is put in the sulphuric acid dip, it must be rinsed before the pre-catalyst stage. Twenty per cent ...
... substrate is rinsed to ensure that none of the chemicals is transferred to the next bath. Each step relies upon the ... substrate is put in the sulphuric acid dip, it must be rinsed before the pre-catalyst stage. Twenty per cent ...
Page 410
... substrate itself, such as inaccuracies in the positioning caused by deviation of the fiducials, is detected by a highresolution CCD camera and compensated for by the control software. Such a system is well suited for prototyping, since ...
... substrate itself, such as inaccuracies in the positioning caused by deviation of the fiducials, is detected by a highresolution CCD camera and compensated for by the control software. Such a system is well suited for prototyping, since ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
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Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire