Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
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Page 118
... Thickness There is no standard rule for the optimum thickness neither for the printed wiring nor for the number of multilayer conductive layers. Occasionally, the limiting factor for printed wiring thickness is the diameter of the ...
... Thickness There is no standard rule for the optimum thickness neither for the printed wiring nor for the number of multilayer conductive layers. Occasionally, the limiting factor for printed wiring thickness is the diameter of the ...
Page 420
... thickness of the prepregs after bonding must be at least twice the thickness of the copper being embedded. In other words, where you have two adjacent copper layers, each of which is 30 mm thick, a minimum prepreg thickness of 2 (2 ¥ 30 ...
... thickness of the prepregs after bonding must be at least twice the thickness of the copper being embedded. In other words, where you have two adjacent copper layers, each of which is 30 mm thick, a minimum prepreg thickness of 2 (2 ¥ 30 ...
Page 425
... thickness after the built-up and final 188 1880 m Per 10 m plating: c Type of material: FR4 Quality of material d Copper thickness of the outer layer after the built up and final plating: 55 55 m Per 1 m e Different kinds of core ...
... thickness after the built-up and final 188 1880 m Per 10 m plating: c Type of material: FR4 Quality of material d Copper thickness of the outer layer after the built up and final plating: 55 55 m Per 1 m e Different kinds of core ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
Other editions - View all
Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire