Printed Circuit Boards: Design, Fabrication, and AssemblyMcGraw Hill Professional, 2005 M09 7 - 704 pages The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing. |
From inside the book
Results 1-3 of 60
Page 166
... wave impedance required for CMOS integrated circuit conductors is 150-300 W. This large value of wave impedance can be obtained by keeping the signal conductor width as low as possible. Normally signal conductors with £0.5 mm width will ...
... wave impedance required for CMOS integrated circuit conductors is 150-300 W. This large value of wave impedance can be obtained by keeping the signal conductor width as low as possible. Normally signal conductors with £0.5 mm width will ...
Page 509
... wave soldering process control needed to ensure high joint quality when using synthetic fluxes (Taylor, 1991b). A preheating stage is always incorporated between the fluxing stage and the wave soldering of the board. There are several ...
... wave soldering process control needed to ensure high joint quality when using synthetic fluxes (Taylor, 1991b). A preheating stage is always incorporated between the fluxing stage and the wave soldering of the board. There are several ...
Page 510
... wave, the temperature is set between 250 °C to Assembled PCB 257 °C and for baths with two waves, the bath ... wave soldering shapes have been used by different equipment manufacturers. In the simplest solder-wave arrangement, the wave ...
... wave, the temperature is set between 250 °C to Assembled PCB 257 °C and for baths with two waves, the bath ... wave soldering shapes have been used by different equipment manufacturers. In the simplest solder-wave arrangement, the wave ...
Contents
1 Basics of Printed Circuit Boards | 1 |
2 Electronic Components | 25 |
3 Layout Planning and Design | 104 |
Copyright | |
15 other sections not shown
Other editions - View all
Printed Circuit Boards : Design, Fabrication, and Assembly: Design ... R. Khandpur No preview available - 2005 |
Common terms and phrases
acid addition adhesive applications assembly base capacitors cause cent chemical cleaning coating complete components conductive conductor connection containing copper cutting defects depends devices dielectric drill edge electrical electronic equipment etching fabrication Figure film flexible flow flux foil function glass ground heat hole impedance important increase inspection insulation integrated interconnections joint laminate laser layers layout lead less machine manufacturing material measured mechanical metal method mount operation package pads pattern performance pins placed plating position possible printed circuit board production range reduce reference removed resin resistance routing screen shown shows side signal solder solder mask solution spacing specific standard steps surface technique temperature thermal thickness through-hole tool traces typical usually various voltage wave width wire